Brazed Liquid Cooling Plate

I. Basic Structure

• Upper cover plate: provides sealing, interfaces and mounting surface
• Middle layer: flow channel plate / turbulence fins / pin fins
• Lower cover plate: bonding surface for heat-generating components

II. Core Process: Vacuum Brazing

1. Sheet metal forming → coating / pre-placing brazing filler metal
2. Stacking and positioning → loading into vacuum brazing furnace
3. High-temperature heating (approx. 600℃ for aluminum)
4. Brazing filler metal melts, wets and fills gaps
5. Cooling and forming to create high-strength sealed welds

• No porosity, no cold joints, extremely high airtightness
• High weld strength and good corrosion resistance
• Enables complex and precise flow channel designs
• Smooth surface, ideal for bonding high-power devices

III. Key Features

• High heat dissipation efficiency

   

  Micro-channels, louvered fins and porous fins can be integrated in the middle layer, delivering large heat exchange area and low thermal resistance.
   
• Strong pressure resistance

   

  Standard pressure rating: 3～10 bar; high-pressure versions exceed 15 bar, suitable for fast charging, energy storage and electric motors.
   
• Reliable sealing

   

  Fully welded structure with nearly zero leakage risk, compliant with helium leak testing.
   
• Excellent surface flatness

   

  Suitable for surface-mounted heat dissipation of IGBTs, SiC modules, power devices, battery packs and other planar components.
   
• Mainly made of aluminum alloy

   

  Commonly uses 3003, 5052, 6061 and other alloys, offering lightweight design, high thermal conductivity and moderate cost.
   

IV. Common Flow Channel Designs

• Serpentine flow channel: simple structure, low pressure drop
• Staggered / parallel multi-channels: uniform heat transfer
• Micro-channel fins: for high heat flux density scenarios
• Pin fin array: ultra-high heat transfer, suitable for GPUs / lasers

V. Typical Applications

• New energy vehicles: motor controllers, OBC, DC-DC converters, 800V SiC modules
• Energy storage & fast charging: PCS energy storage converters, ultra-fast charging stations, heat dissipation for flash charging shunts
• Industrial control & power: SVG, photovoltaic inverters, high-voltage inverters
• Optoelectronics & computing power: lasers, GPU servers, radar systems

VI. Comparison with Other Liquid Cooling Plates

• vs Friction stir welded liquid cooling plates:

   

  Brazing is more suitable for precise flow channels and high heat flux density; friction welding performs better for large-size and high-flow applications.
   
• vs Extruded profile liquid cooling plates:

   

  Brazed plates offer more flexible flow channel design and stronger heat dissipation, at a higher cost.
   
• vs Tube-embedded liquid cooling plates:

   

  Better bonding performance and lower thermal resistance, ideal for high-power devices.