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Aluminum Folded Fin Heatsink High-Performance Thermal Management Component
Produktdetails:
| Herkunftsort: | Dongguan, Guangdong, China |
| Markenname: | Uchi |
| Zertifizierung: | SMC |
| Modellnummer: | Kühlkörper |
Zahlung und Versand AGB:
| Min Bestellmenge: | 100 Stück |
|---|---|
| Preis: | 1300-1500 dollars |
| Lieferzeit: | Nicht begrenzt |
| Zahlungsbedingungen: | T/T, Paypal, Western Union, MoneyGram |
| Versorgungsmaterial-Fähigkeit: | 50000000 Stück pro Monat |
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Detailinformationen |
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| Material: | Kupfer | Größe: | 22,5 * 11,4 * 0,8 cm |
|---|---|---|---|
| Gewicht:: | 0,08 kg | Technologie: | Stempeln |
| Besonderheit: | Flexibel und anpassbar | Oberflächenbehandlung: | Ölreinigung |
| Wärme-Kühlleistung: | 30W | ||
| Hervorheben: | aluminum folded fin heatsink,high-performance thermal management component,liquid cooling plate heatsink |
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Produkt-Beschreibung
Aluminum Folded Fin Heatsink
Product parameters of Aluminum Folded Fin Heatsink
Material: copper
Size:22.5*11.4*0.8CM
Weight: 0.08kg
Technology: Stamping
Feature: Flexible and adjustable
Surface treatment: Oil-cleaning
Heat cooling power: 30W
Product advantage of Aluminum Folded Fin Heatsink
Every electrical and electronic component in a circuit generates some amount of heat while the circuit is executed by providing power supply. Typically high-power semiconducting devices like power transistors and the opto electronics such as light emitting diodes,lasers generate heat in considerable amounts and these components are inadequate to dissipate heat, as their dissipation capability is significantly low.
Due to this, heating up of the components leads to premature failure and may cause failure of the entire circuit or system’s performance. So, to conquer these negative aspects, heat sinks must be provided for cooling purpose.
What is a Heat Sink?
Heat sink is an electronic component or a device of an electronic circuit which disperses heat from other components (mainly from the power transistors) of a circuit into the surrounding medium and cools them for improving their performance, reliability and also avoids the premature failure of the components. For the cooling purpose,it incorporates a fan or cooling device.
Manufacturing & Materials
- Process: Thin aluminum sheets (0.1–0.5 mm typical, 0.2–1.2 mm common range) are precision-folded into a corrugated/zig-zag array, then bonded to an aluminum base plate via soldering, brazing, or high-performance thermal epoxy. This allows independent optimization of fin density and base thickness, and even mixed-material combinations (e.g., copper base+aluminum fins).
- Common Alloys: 1050/1100 (high purity, excellent thermal conductivity), 6061/6063 (good strength+thermal performance, cost-effective).
- Key Parameters: Fin pitch down to 0.5 mm, fin height up to 100 mm, fin width up to 500 mm.
Core Advantages
- High Surface Area-to-Volume Ratio: Far denser than extruded fins, ideal for space-constrained, high-heat applications, with reduced thermal resistance (up to 60% vs. some traditional designs).
- Lightweight & Material-Efficient: Uses minimal aluminum while maximizing cooling surface.
- Flexible Design: Easy customization of fin height, pitch, and shape for forced/natural convection.
- Compatible with Heat Pipes/Vapor Chambers: Often integrated for enhanced thermal spreading in high-power systems.
Applications
| Type | Pros | Cons | Best For |
|---|---|---|---|
| Folded Fin (Aluminum) | Ultra-high surface area, lightweight, customizable | Higher cost than extrusion, requires bonding | High-power, compact, forced-air systems |
| Extruded Aluminum | Low cost, simple manufacturing, rigid | Limited fin density/aspect ratio | Low-to-mid power, cost-sensitive applications |
| Skived Fin | Excellent thermal contact, high density | Limited fin height, higher tooling cost | Heat pipes, high-performance CPUs |
Selection & Optimization Tips
- Thermal Load & Airflow: Calculate required thermal resistance (Rθ) and match to airflow (LFM/CFM); forced air works far better with dense folded fins.
- Fin Pitch & Height: Tighter pitch=more surface area, but may restrict airflow; taller fins boost convection but increase weight/backpressure.
- Bonding Quality: Poor soldering/brazing creates contact resistance—verify bond integrity via thermal imaging or resistance testing.
- Surface Treatment: Anodizing improves corrosion resistance and can slightly enhance radiation; black anodize helps in radiative cooling scenarios.
